芯片半导体 · SemiWiki
三维国际象棋有人吗？多模具设计的电源完整性的挑战
发布于 · 本站收录 2026-11-11 00:33
长期以来，电源完整性一直是一项重大的设计挑战。在多模具时代，与 EMIR 分析相关的问题现在必须超越芯片，考虑整个堆栈中的交互。要分析的影响跨越多维、多材料空间。
英文原文标题与摘要
Three-Dimensional Chess Anyone? The Challenges of Power Integrity for Multi-Die Designs
Power integrity has been a substantial design challenge for a long time. In the multi-die era, the problems associated with EMIR analysis must now move beyond the chip to consider interactions across the entire stack. The effects to be analyzed span a multi-dimensional, multi-material space. The graphic at the top of this post… Read More
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